GE 259B2460BTG2 – Backplane Assembly Board

Board Type:Advanced Backplane Assembly

Model Number:259B2460BTG2

Material:High-grade aluminum alloy for superior thermal conductivity and durability

Dimensions:450mm x 100mm x 10mm

Weight:Approximately 1.5kg

Data Transmission Speed:Up to 10 Gbps

Power Consumption:Low power design for energy efficiency

Operating Temperature Range:-20°C to +70°C

Compliance Standards:UL, CE, FCC certified for global compatibility

Connector Compatibility:Supports various industry-standard connectors for seamless integration

    The GE 259B2460BTG2 Backplane Assembly Board is meticulously engineered for unparalleled reliability and efficiency in industrial control systems. Its robust design ensures seamless integration with existing systems, enhancing operational performance across various industries.

    This board supports an array of high-speed serial ports, enabling efficient data exchange and processing in real-time applications. It’s designed to withstand extreme environmental conditions, making it suitable for deployment in harsh industrial settings.

    Crafted from high-quality materials, this board is built to last, offering exceptional durability and resistance against wear and tear. Its compact yet powerful architecture optimizes space utilization without compromising on functionality.

    Ease of installation and compatibility with industry-standard protocols make the GE 259B2460BTG2 Backplane Assembly Board an ideal choice for upgrading or expanding existing automation infrastructures. Its modular design allows for flexible integration and scalability.

    Equipped with advanced diagnostics and monitoring capabilities, this board ensures continuous system health, enabling proactive maintenance and minimizing downtime. Backed by GE’s commitment to quality, this product is supported by comprehensive technical documentation and customer service, ensuring smooth deployment and ongoing support.