Model Type:Compact Control Module
Operating System:GE Intelligent Platforms Software Suite
Processing Speed:Up to 1 MHz
Memory Capacity:128 KB RAM, 32 KB Flash ROM
Power Consumption:≤ 5 W
Operating Temperature:-10°C to +55°C
Storage Temperature:-40°C to +70°C
Reliability Rating:MTBF > 200,000 hours
Communication Protocols:Modbus, Ethernet/IP, DeviceNet
The GE-FANUC IC693MDL230 is a cutting-edge modular controller designed to optimize performance in the PAC Systems RX3i. With its robust design and comprehensive feature set, it seamlessly integrates into a wide array of industrial automation scenarios. Its versatile communication interfaces facilitate seamless data exchange with various peripherals and systems, enhancing operational efficiency.
Equipped with an extensive memory capacity, this controller ensures efficient storage and retrieval of data, crucial for complex automation tasks. The on-board CPU, operating at up to 120 MHz, delivers swift processing speeds, enabling real-time response to dynamic operational demands.
The controller’s broad temperature range of -20°C to +60°C makes it suitable for use in a variety of industrial environments, ensuring reliable operation under challenging conditions. Its low power consumption of max. 10 W further contributes to energy efficiency and cost savings.
For those seeking to expand their automation capabilities, the IC693MDL230 offers exceptional scalability. It can be easily integrated with existing systems and can accommodate additional modules without compromising system integrity or performance.
This modular controller is the perfect choice for engineers and technicians looking to enhance productivity, streamline operations, and achieve higher levels of automation in their facilities. Its compatibility with the GE-FANUC ecosystem ensures a seamless integration experience, making it a valuable asset for modern industrial setups.
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