LAM Electronics LAM 839-800327-315 Electrostatic Chuck

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The LAM 839-800327-315 Electrostatic Chuck is a precision tool designed for semiconductor wafer bonding processes, ensuring high accuracy and efficiency in manufacturing.

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Material:Premium grade stainless steel

Max Temperature Resistance:Up to 300°C

Vacuum Compatibility:Excellent, up to 1×10^-5 Torr

Electrostatic Force Range:Adjustable from 10N to 100N

Power Supply Voltage:24VDC

Control System Compatibility:Standard RS-232 interface

    The LAM ELECTROSTATIC CHUCK 839-800327-315 is engineered to meet the demanding requirements of semiconductor manufacturing. Its advanced electrostatic force regulation system allows for unparalleled precision in wafer positioning and pressure control, ensuring optimal performance during various processing stages.

    Crafted from a high-strength, corrosion-resistant aluminum alloy, this chuck is built to withstand the rigors of continuous use in cleanroom environments. Its ability to maintain precise control over wafer conditions across a wide temperature range (-40°C to 150°C) makes it suitable for a variety of processing conditions.

    With exceptional vacuum compatibility, achieving ultra-high vacuum levels (up to 1 x 10^-6 Torr), this electrostatic chuck supports the most stringent vacuum processes required for semiconductor fabrication, including etching, deposition, and other critical steps.

    The chuck’s compact yet robust design measures 315mm x 315mm x 50mm, offering a versatile fit for a wide range of wafer sizes while ensuring easy integration into existing manufacturing setups.

    Equipped with a maximum load capacity of 15kg, it can handle the weight of various wafer types and sizes without compromising stability or performance, making it an indispensable tool in the semiconductor industry.

LAM 839-800327-315 ELECTROSTATIC CHUCK




     

     

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